Foundry Revenue by Company
Quarterly foundry revenue in $ billions. Samsung figures are foundry division only. Sources: company earnings reports, TrendForce quarterly reports.
Process Node Status by Foundry
| Foundry | 7nm / N7 | 5nm / N5 | 4nm / N4 | 3nm / N3 | 2nm / N2 |
|---|---|---|---|---|---|
 TSMC | Mass ProductionHVM: 201814% of rev | Mass ProductionHVM: 202035% of rev | Mass ProductionHVM: 2022 | Mass ProductionHVM: 202228% of rev | RampingHVM: 2025 Q4 |
 Samsung | Mass ProductionHVM: 201920% of rev | Mass ProductionHVM: 202125% of rev | Mass ProductionHVM: 202230% of rev | Mass ProductionHVM: 202410% of rev | In DevelopmentHVM: Late 2025 |
 Intel Foundry | Mass ProductionHVM: 2021 (Intel 4)30% of rev | Mass ProductionHVM: 2024 (Intel 3)15% of rev | CancelledHVM: Cancelled (Intel 20A) | Risk ProductionHVM: H2 2025 (Intel 18A) | In DevelopmentHVM: 2027 (Intel 14A) |
HVM = High Volume Manufacturing start date. Revenue share = approximate % of foundry revenue from that node. Intel node names mapped to equivalent nm (Intel 4 ≈ 5nm, Intel 18A ≈ 2nm class). Intel 20A was cancelled; resources shifted to Intel 18A. Sources: company earnings, TechInsights.
Global Fab Locations
TSMC
6 facilitiesHsinchu, Taiwan
HQ and primary R&D center — N2 volume production and A16 planned H2 2026
Tainan, Taiwan
Fab 18 — world's first 3nm mass production facility, major 2nm expansion planned
Kaohsiung, Taiwan
2nm volume production began Q4 2025 — NT$1.5T investment, 6 phases planned by end 2027
Phoenix, Arizona
Fab 1 (N4) operational Q4 2024. 6 fabs planned totaling $165B — Fab 2 N3 by 2027, Fab 3 N2/A16 by end of decade
Kumamoto, Japan
JASM joint venture — operational since Dec 2024. Phase 2 (6nm) under construction, expected 2027
Dresden, Germany
ESMC joint venture — equipment move-in H2 2026, production late 2027
Samsung
4 facilitiesHwaseong, South Korea
Largest Samsung fab complex — 3nm GAA production, first High-NA EUV arrived March 2025
Pyeongtaek, South Korea
World's largest semiconductor campus — P4 converting to 1c DRAM
Taylor, Texas
92% complete — delayed to mass production early 2027 (from 2024). Tesla as anchor customer via $16.5B long-term contract
Austin, Texas
Operational on mature nodes — contributing $19.8B to local economy
Intel
4 facilitiesHillsboro, Oregon
D1X — $36B investment, R&D hub, High-NA EUV assembly completed
Chandler, Arizona
Fab 52 — 18A mass production beginning 2025, 15 EUV machines planned
Leixlip, Ireland
Fab 34 — Intel 4 production since Sept 2023, Intel 3 shifting to HVM 2025
New Albany, Ohio
$28B fab complex — delayed to 2030-2031 (5-year delay from original plan)
SK Hynix
3 facilitiesIcheon, South Korea
HQ — 12-layer HBM mass production since Sept 2024, 130K units/month
Cheongju, South Korea
M15X — cleanroom opened Oct 2025, commercial production Feb 2026, KRW 20T+ investment
West Lafayette, Indiana
$3.87B advanced packaging facility — groundbreaking March 2025, mass production H2 2028
Micron
3 facilitiesBoise, Idaho
$15B new fab (ID1) under construction, wafer output H2 2027. $30B second fab (ID2) also announced
Hiroshima, Japan
1-gamma DRAM and EUV production. New HBM fab: JPY 1.5T (~$9.6B), HBM shipments ~2028
Clay, New York
Groundbreaking March 2026 — Fab 1 operations Q3 2030 (2-year delay). Up to $100B over 20+ years
Major semiconductor fabrication facilities. “Building” includes under construction and in equipment installation. Sources: company announcements, CHIPS Act filings, press releases.